Senin, 16 November 2015

Free PDF Plastic Films: Technology and Packaging ApplicationsBy Wilmer A. Jenkins, Kenton R. Osborn

Free PDF Plastic Films: Technology and Packaging ApplicationsBy Wilmer A. Jenkins, Kenton R. Osborn

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Plastic Films: Technology and Packaging ApplicationsBy Wilmer A. Jenkins, Kenton R. Osborn

Plastic Films: Technology and Packaging ApplicationsBy Wilmer A. Jenkins, Kenton R. Osborn


Plastic Films: Technology and Packaging ApplicationsBy Wilmer A. Jenkins, Kenton R. Osborn


Free PDF Plastic Films: Technology and Packaging ApplicationsBy Wilmer A. Jenkins, Kenton R. Osborn

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Plastic Films: Technology and Packaging ApplicationsBy Wilmer A. Jenkins, Kenton R. Osborn

This is a complete illustrated guide and reference to today's plastic films for packaging. All significant aspects of plastic films for packaging are clearly and concisely presented: from materials, processes and machinery to applications and regulatory, social and economic considerations. More than 70 schematics illustrate materials, processes and package constructions. More than 30 tables provide important reference data in convenient form. The authors are leading authorities on plastic packaging films with first-hand experience in the R&D of many of today's widely used films. Published in cooperation with the Institute of Packaging Professionals.

  • Amazon Sales Rank: #1825765 in Books
  • Published on: 1992-09-25
  • Original language: English
  • Number of items: 1
  • Dimensions: 9.50" h x 6.50" w x 1.00" l, 1.11 pounds
  • Binding: Hardcover
  • 272 pages

Review All in all, the book offers an outstanding and comprehensive entry into the topic of plastic films. With its careful explanation of technical terms, the book could be recommended even to nonspecialists.-W. Glenz, Kunststoffe, German Plastics FederationAltogether it presents a very interesting text which provides great help for all those connected with the sector of films for packaging.-Revista de Plasticos Modernos (leading plastics magazine of Spain)

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Plastic Films: Technology and Packaging ApplicationsBy Wilmer A. Jenkins, Kenton R. Osborn PDF
Plastic Films: Technology and Packaging ApplicationsBy Wilmer A. Jenkins, Kenton R. Osborn PDF

Selasa, 10 November 2015

Download Ebook Microwave Solid State Circuit DesignBy Inder Bahl, Prakash Bhartia

Download Ebook Microwave Solid State Circuit DesignBy Inder Bahl, Prakash Bhartia

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Microwave Solid State Circuit DesignBy Inder Bahl, Prakash Bhartia

Microwave Solid State Circuit DesignBy Inder Bahl, Prakash Bhartia


Microwave Solid State Circuit DesignBy Inder Bahl, Prakash Bhartia


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Microwave Solid State Circuit DesignBy Inder Bahl, Prakash Bhartia

  • Provides detailed coverage of passive and active RF and microwave circuit design.
  • Discusses the practical aspects of microwave circuits including fabrication technologies.
  • Includes a treatment of heterostructure and wide-band gap devices.
  • Examines compact and low cost circuit design methodologies.

  • Sales Rank: #1851019 in Books
  • Published on: 2003-04-18
  • Ingredients: Example Ingredients
  • Original language: English
  • Number of items: 1
  • Dimensions: 9.39" h x 1.92" w x 6.34" l, 3.00 pounds
  • Binding: Hardcover
  • 920 pages

From the Publisher
This contributed volume presents a comprehensive discussion of the design of passive circuits, solid state devices, and microwave solid state circuits. Because this is a very diversified area, the subject can only be covered well by a team of authors who are specialists in different topics. The editors of this book have brought together just such a team. Coverage is state-of-the-art and includes extensive references and problems. Topics covered include transmission lines and lumped elements, resonators, impedance matching networks, hybrids and couplers, filters, active and passive solid state devices, oscillators, amplifiers, detectors and mixers, microwave control circuits, frequency multipliers and dividers, computer-aided design, microwave integrated circuits, and future trends in microwave circuits. Appendixes cover S-parameters and ABCD parameters; transfer functions: Bessel, Butterworth, Chebyshev, Gaussian, etc.; nonreciprocal components, and noise.

From the Back Cover
The new edition of an essential guide to MMIC

Monolithic microwave integrated circuits (MMICs) based on gallium arsenide (GaAs) technology are increasingly important in applications where component size and performance are prime factors. These include electronic systems for satellite communications, phased-array radar systems, electronic warfare, and other military applications, as well as consumer electronics. The new Second Edition of Microwave Solid State Circuit Design presents a comprehensive discussion of the most current trends in RF and microwave circuits technologies.

This contributed volume brings together a team of experts to provide state-of-the-art coverage of network theory basics, the design of passive circuits, solid state devices, and microwave solid state circuits. Richly supported by extensive references and problems, the book examines transmission lines and lumped elements, resonators, impedance matching networks, hybrids and couplers, filters, active and passive solid state devices, oscillators, amplifiers, detectors and mixers, microwave control circuits, frequency multipliers and dividers, MEMS, and circuit fabrication technologies. Appendixes cover S-parameters and ABCD parameters, transfer functions, including Butterworth and Chebyshev, units and symbols, as well as physical constants. Features include:
* Comprehensive coverage of passive and active RF and microwave circuit design
* Treatment of practical aspects of microwave circuits including fabrication technologies
* An overview of MEMS technology
* Treatment of heterostructure and wide-band gap devices
* Inclusion of compact and low-cost circuit design methodologies

Thorough and up to date, this Second Edition of a key reference remains a valuable resource for researchers, engineers, and graduate students in RF and microwave engineering.

About the Author
INDER BAHL, PhD, received a PhD in electrical engineering from the Indian Institute of Technology, Kanpur, India in 1975. Currently a Distinguished Fellow of Technology at M/A-COM, Dr. Bahl has over thirty years of experience in microwave technology, including twenty years in the GaAs MMIC-related topics. He has authored over 140 research papers, ten books, and holds fifteen patents. Dr. Bahl is an IEEE fellow and a member of the Electromagnetic Academy.
PRAKASH BHARTIA, PhD, obtained his MSc and PhD degrees from the University of Manitoba, Winnipeg. He is currently Director General of the DRDC Ottawa laboratory in Ottawa. He has published extensively in refereed journals and has many books and patents to his credit. Dr. Bhartia is a Fellow of the Royal Society of Canada, a Fellow of the IEEE, IETE, Canadian Academy of Engineers, and the Engineering Institute of Canada. In 2002, he was awarded IEEE Canada's highest award, the A. G. L. McNaughton Gold Medal for Exceptional Contributions to Engineering.

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